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     DHG 30 I 600HA advanced IRMS A per pin* 70 RthCH K/W 0.25 MD Nm 1.2 mounting torque 0.8 Tstg °C 150 storage temperature -55 Weight g 6 Dim. Millimeter Inches Min. Max. Min. Max. A 19.81 20.32 0.780 0.800 B 20.80 21.46 0.819 0.845 C 15.75 16.26 0.610 0.640 D 3.55 3.65 0.140 0.144 E 4.32 5.49 0.170 0.216 F 5.4 6.2 0.212 0.244 G 1.65 2.13 0.065 0.084 H - 4.5 - 0.177 J 1.0 1.4 0.040 0.055 K 10.8 11.0 0.426 0.433 L 4.7 5.3 0.185 0.209 M 0.4 0.8 0.016 0.031 N 1.5 2.49 0.087 0.102 Symbol Definition Ratings typ. max. min. Conditions RMS current thermal resistance case to heatsink Unit * Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip. In case of 1, a common cathode/anode configuration and a no n-isolated backside, the whole current capability can be used by connecting the backside. Outlines TO-247AD F C N 120 mounting force with clip 20 IXYS reserves the right to change limits, conditions and dimensions. ? 2006 IXYS all rights reserved 0614 * Data according to IEC 60747and per diode unless otherwise specified |